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Product Guide Semiconductor Flat Panel Display Data Storage
Semiconductor Nikko Materials offers a wide range of sputtering targets for all semiconductor thin film applications including: copper and aluminum for interconnect; titanium and tantalum for barrier; cobalt and nickel for gate. Specialty alloys and compositions can also be developed for research and development needs. Target materials are available in a variety of grades and purities to meet specific customer requirements. Target microstructure and magnetic permeability (for ferro-magnetic materials) are also controlled to maximize target performance. Targets are available in configurations for all major PVD sputtering systems. Expertise and extensive experience with a variety of bonding technologies (solder bonding, electron-beam welding, and diffusion bonding) assures bonding efficiency without affecting target microstructure.
Target Materials: • Aluminum Alloys Semiconductor Sputter Equipment Manufacturers: • Anelva
Materials Aluminum Sputtering Targets 
Our Aluminum targets feature fine and uniform grain size throughout the target for smooth erosion and stable uniformity. For advanced interconnect needs, we offer Graphite Related Inclusion Free (GRIF) grade for particle performance vastly superior to conventional targets. In addition to standard monolithic and solder-bonded assemblies, we also have developed diffusion bonding for high power processes.
Aluminum Material Data Summary
Cobalt Sputtering Targets 
We developed our Cobalt target to meet the stringent demands of semiconductor manufacturers for film quality and target permeability. Our cobalt is refined internally to 5N purity and very low and uniform magnetic permeability assures adequate flux reaches the target for plasma stability. Available in thick nesses up to 3mm for reduced chance of sputter-through. Cobalt Material Data Summary
Copper Sputtering Targets 
Our 6N copper is ideal for the high quality thin films needed for advanced interconnect applications. Internal refining ensures a stable low cost, quality material with very low impurities (especially oxygen and sulfur). Microstructure is also fine and uniform throughout the target for smooth erosion. Specialty copper alloys also available.
Copper Material Data Summary
Sputter Ready™ Titanium Targets 
The next phase in Sputtering Targets for Applied Materials Vectra IMP Source is here. Sputter Ready™ Titanium targets have been shown to drastically reduce burn-in times for maximum throughput. Combined with our Super Fine Grain microstructure, Sputter Ready™ Titanium targets have also been shown to reduce particle generation. Tantalum Sputtering Target 
For interconnect applications utilizing copper, Tantalum is widely considered an ideal barrier layer. Tantalum targets feature uniform grain size for smooth erosion. To reduce material used in production, a diffusion bonding process has been developed that is available on most planar and conical targets. Tantalum Material Data Summary
Titanium Sputtering Target 
Our Titanium targets are recognized for their quality world-wide. We have brought all our expertise in grain size control, surface preparation, and diffusion bonding to create targets of exceptional quality and performance. SFG (Super Fine Grain) grade was introduced to reduce particles from nodules and Sputter Ready™ surface treatment was developed to reduce burn-in. Titanium Material Data Summary
Tungsten Sputtering Target 
Our ultra-high density targets provide thin films of exceptional quality. High density assures that particles from sputtering are minimized while a fine microstructure assures a smooth eroded surface. Available in diffusion bonded assemblies for high power processes. Tungsten Material Data Summary
Electroplating Anodes 
As a leader in providing advanced sputtering targets, Nikko Materials understands the strict requirements of semiconductor metalization and back-end packaging applications. OPTIPLATE™ anodes were developed with these industry expectations in mind. They are manufactured using the same processes developed for sputtering targets to ensure consistency and performance. With Nikko Materials' OPTIPLATE anodes you can be assured of consistent, quality performance for your electroplating needs - from interconnect to back-end packaging. Available in a variety of size, and configurations, including specialty material compositions and microstructures. Typical Materials Aluminum alloys • Copper Download more information about our products.
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